C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 63/08 (2006.01) C08G 59/34 (2006.01) C08L 47/00 (2006.01) C08L 53/00 (2006.01) C09J 119/00 (2006.01) C09J 147/00 (2006.01) C09J 153/00 (2006.01) C09J 153/02 (2006.01) C09J 163/08 (2006.01)
Patent
CA 2202277
A curable binder for pressure sensitive adhesives and sealants which comprises from 20 to 95 % by weight of an epoxidized polydiene polymer and from 5 to 80 % by weight of a monohydroxylated diene polymer.
Ce liant durcissable, destiné à des adhésifs et à des matériaux d'étanchéité autocollants, comprend de 20 à 95 % en poids d'un polymère de polydiène époxydé ainsi que de 5 à 80 % en poids d'un polymère de diène monohydroxylé.
Erickson James Robert
Masse Michael Alan
St. Clair David John
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
Shell Internationale Research Maatschappij B.v.
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