Curable bismaleimide adducts

C - Chemistry – Metallurgy – 07 – D

Patent

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Details

260/306.3, 154/1

C07D 207/416 (2006.01) C08G 73/12 (2006.01) C09J 179/08 (2006.01)

Patent

CA 2014380

- 7 - Abstract of the Disclosure: An adduct of bismaleimide and 4-aminobenzocyclobutene can be used as an adhesive which on curing produces a temperature resistant bond.

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