Curable composition

Details Curable composition Curable composition

C - Chemistry, Metallurgy

08

G

402/252, 400/504

C08G 59/60 (2006.01) C08G 8/36 (2006.01) C08G 59/14 (2006.01) C08G 59/18 (2006.01) C08G 59/40 (2006.01)

Patent

CA 1197041

Abstract of the Disclosure A curable resin composition comprising an epoxy resin, a hardener and an epoxy compound- dialkylamine adduct as a latent hardener. The composition is excellent in storage stability at ambient temperatures and rapidly curable under heat- ing conditions, and is usable as adhesives, paints, molding materials, casting materials and so on.

376518

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