Curable composition

C - Chemistry – Metallurgy – 08 – J

Patent

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Details

402/19, 400/5332

C08J 3/24 (2006.01) C08L 101/02 (2006.01) C09D 201/10 (2006.01)

Patent

CA 2011801

CURABLE COMPOSITION COMPRISING AN EPOXY/SILANOL RESIN SYSTEM ABSTRACT OF THE DISCLOSURE This invention provides a curable composition comprising: (I) a resin component containing as essential functional groups epoxy group, and silanol group and/or hydrolyzable group directly attached to silicon atom, (II) at least one crosslinking agent selected from the group consisting of carboxylic acid compounds, polyisocyanate compounds and aminoaldehyde resins, and (III) at least one curing catalyst selected from the group consisting o organometallic compounds, Lewis acids, protonic acids and compounds having Si-O-Al bond or bonds.

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