C - Chemistry – Metallurgy – 09 – K
Patent
C - Chemistry, Metallurgy
09
K
C09K 3/00 (2006.01) B05D 5/06 (2006.01) C08L 101/00 (2006.01) C09D 4/00 (2006.01) C09D 183/05 (2006.01) C09D 201/00 (2006.01) H01L 23/29 (2006.01) H01L 33/00 (2006.01)
Patent
CA 2516404
A light-shielding paste composed of a specific component and an inorganic material is disclosed. A method for providing an LED package with a light- shielding resin layer by applying the light-shielding paste only to the side walls of the package is also disclosed. Since the light-shielding paste has a low fluidity, it is possible to form a cured product thereof only on the side walls of the LED package. With this light-shielding resin layer forming method, light-shielding resin layers can be efficiently formed only on the side walls of the LED packages, thereby greatly improving the productivity.
L'invention concerne une pâte photoprotectrice constituée d'un composant spécifique et d'une matière inorganique ; et un procédé permettant de pourvoir un boîtier de diode électroluminescente d'une couche de résine photoprotectrice, qui consiste à appliquer la pâte photoprotectrice uniquement sur les parois latérales du boîtier. Ladite pâte présentant une faible fluidité, le produit traité de celle-ci n'est formé que sur les parois latérales du boîtier. Le procédé de formation d'une couche de résine photoprotectrice permet de former efficacement des couches de résine photoprotectrice uniquement sur les parois latérales de boîtiers de diode électroluminescente, ce qui permet d'améliorer considérablement la productivité.
Katsuya Ouchi
Manabu Tsumura
Masafumi Kuramoto
Masahito Ide
Tomohide Miki
Kaneka Corporation
Nichia Corporation
Riches Mckenzie & Herbert Llp
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