Curable compositions

Details Curable compositions Curable compositions

B - Operations, Transporting

29

C

B29C 39/40 (2006.01) B29C 39/00 (2006.01) B29C 67/24 (2006.01) C08G 59/18 (2006.01) C08G 59/42 (2006.01) C08J 3/24 (2006.01) C08L 63/02 (2006.01)

Patent

CA 2111719

Abstract of Disclosure Curable Composition A process for making a cured plastics moulding by introducing a pre-heated curable resin composition to a hotter mould which is at a temperature high enough to initiate curing of the resin, and supplying further resin under pressure to compensate for shrinkage of the composition wherein the curable resin is a formulation comprising an aromatic glycidyl ether epoxy resin, an inert filler, a quaternary ammonium or phosphonium salt as accelerator, 0.5-1.2 mol per mol epoxy of a saturated cycloaliphatic anhydride and a polycarboxylic acid preferably derived from the reaction of a polyol, this acid being present at a level of 0.05-0.5 mol carboxyl per mol epoxy.

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