Curable compositions

Details Curable compositions Curable compositions

C - Chemistry, Metallurgy

08

G

252/124, 402/268

C08G 59/40 (2006.01) C08G 59/18 (2006.01) C08G 59/68 (2006.01) C08L 61/06 (2006.01) C08L 63/00 (2006.01) C09J 163/00 (2006.01)

Patent

CA 1240440

ABSTRACT CURABLE COMPOSITIONS Compositions useful as adhesives, sealants, laminating resins and coatings comprise a) an epoxide resin b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide or isophthalic acid dihydrazide and c) as accelerator for the cure, and dispersed as a powder in a) and b), a solid solution of a nitrogen base having a boiling point above 130°C and a polymer of an unsaturated phanol. Typical nitrogen bases used in c) include benzyldimethylamine, 2-methylaminoethanol, isophorone diamine triethylene tetramine, and 2-methylimidazole. Typical polymeric phenols include poly(p-vinylphenol).

505332

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