Curable compositions

Details Curable compositions Curable compositions

C - Chemistry, Metallurgy

08

G

402/268, 154/107

C08G 59/56 (2006.01) C08G 59/18 (2006.01) C08G 59/40 (2006.01) C08G 59/68 (2006.01)

Patent

CA 1272346

ABSTRACT CURABLE COMPOSITIONS Compositions useful as adhesives, sealants, laminating resins and coatings comprise (a) an epoxide resin (b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide or isophthalic acid dihydrazide and (c) as accelerator for the cure, and dispersed as a powder in (a) and (b), a reaction product of a nitrogen base and a halogen- substituted monomeric phenol. Typical nitrogen bases used in (c) include N,N-dimethyl-1,3- propanediamine, 2,4,6-tris(dimethylaminomethyl)phenol and 2-methyl- imidazole. Typical halogen-substituted phenols include 2,4,6- trichlorophenol, 2,4,6-tribromophenol, tetrachlorobisphenol A and tetrabromobisphenol A.

532858

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