C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
402/143, 402/168
C08G 18/58 (2006.01) C08G 18/10 (2006.01) C08G 59/40 (2006.01)
Patent
CA 1197344
CURABLE EPOXY-CONTAINING COMPOSITIONS Abstract of the Invention This invention is directed to latent thermal curing agents for epoxy resins comprising cyanourea compounds of the formula: Image wherein R is the organic moiety of a mono- or poly- isocyanate remaining after reaction of the isocyanate group or groups to form cyanourea groups and n is 1 or more, preferably 1 to 2. The epoxy-curing agent system is stable at room temperature and cures at temperatures above 100°C to form a crosslinked, solid material suitable as an adhesive, sealant or coating. The polymeric form polymerized from dicyanourea compound can be dissolved in a solvent and admixed with an epoxy resin to form a thermoset adhesive, sealant or coating on heating above 100°C. The polymeric form from the combination of cyanourea and dicyanourea or dicyanourea per se dissolving in epoxy resin also forms a thermosetting adhesive, sealant or coating on heating above 100°C. - 1 -
414755
Gowling Lafleur Henderson Llp
Grace (w.r.) & Co.
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