Curable epoxy resin composition

Details Curable epoxy resin composition Curable epoxy resin composition

C - Chemistry, Metallurgy

08

L

C08L 63/00 (2006.01) C08G 59/32 (2006.01) C08L 101/00 (2006.01) C09D 163/00 (2006.01)

Patent

CA 2055642

K-18433/A/CGW 26 Curable epoxy resin composition Abstract of the Disclosure Curable epoxy resin compositions comprising (a) 30 to 70 parts by weight of a tetraglycidyl compound of formula Image wherein R1, R2, R3 and R4 are each independently of one another a hydrogen atom, a halogen atom or C1-C4alkyl, with the proviso that at least one of the substituents R1 to R4 is C1-C4alkyl, (b) 70 to 30 parts by weight of an aromatic glycidyl ether containing on average 2.0 to 3.0 glycidyl ether groups in the molecule, such that the amount of (a) and (b) together is 100 parts by weight, (c) a diaminodiphenylsulfone in an amount such as to supply 0.6 to 1.3 equivalents of amino hydrogen atoms per 1 epoxide equivalent of the epoxy resin component consisting of (a) and (b), and (d) I to 50 parts by weight, based on 100 parts by weight of (a) and (b), of a thermoplastic resin dissolved therein having a glass transition temperature of at least 150°C, are suitable for the preparation of cured articles, especially for making prepregs for the preparation of fibre-reinforced composites

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