Curable epoxy resin composition

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

C08G 59/22 (2006.01) C08G 59/42 (2006.01) C08G 59/62 (2006.01) H01B 3/40 (2006.01)

Patent

CA 2682617

Curable epoxy resin composition, which comprises: i) at least one diglycidyl ether of bisphenol A (DGEBA) and at least one diglycidyl ethers of bisphenol F (DGEBF) as epoxy resins, wherein the weight ratio of DGEBA : DGEBF is within the range of about 15:85 to 45:55; ii) an anhydride hardener; iii) at least one plasticizer; iv) optionally a catalyst, at least one filler material and/or further additives; and wherein the dynamic complex viscosity value (.eta.*) of said composition is within the range of 0.1 to 20 Pa. s; a process for making said composition and electrical articles containing an electrical insulation system made from said composition.

L'invention concerne une composition de résine époxy durcissable qui comprend : i) au moins un éther de diglycidyle de bisphénol A (DGEBA) et au moins un éther de diglycidyle de bisphénol F (DGEBF) en tant que résines époxy, où le rapport pondéral de DGEBA : DGEBF est compris entre environ 15:85 et 45:55; ii) un durcisseur anhydride ; iii) au moins un plastifiant ; iv) au choix un catalyseur, au moins un matériau de remplissage et/ou d'autres additifs ; et où la valeur de viscosité complexe dynamique (.eta.*) de ladite composition est comprise entre 0.1 et 20 Pa.s . L'invention concerne également un processus permettant de produire ladite composition et des articles électriques contenant un système d'isolation électrique fait à partir de ladite composition.

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