C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4110, 400/41
C08L 83/04 (2006.01) C08G 59/30 (2006.01) C08L 61/06 (2006.01) C08L 63/00 (2006.01) C08L 83/10 (2006.01)
Patent
CA 2030959
CURABLE EPOXY RESIN COMPOSITIONS ABSTRACT Disclosed are curable epoxy resin molding compositions comprising (a) an epoxy resin, optionally a phenolic resin, and (c) a silicone-modified resin selected from a reaction product of an epoxy resin with an amino-modified polysiloxane having an amino group at only one end of its chain or a reaction product of a phenolic resin with an epoxy-modified polysiloxane having an epoxy group at only one end of its chain. The molding compositions retain good moldability while showing excellent mechanical strength and low internal stress.
Fuji Tadashi
Ona Isao
Ueki Hiroshi
Dow Corning Toray Silicone Company Ltd.
Fuji Tadashi
Gowling Lafleur Henderson Llp
Ona Isao
Ueki Hiroshi
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