Curable epoxy resin compositions

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/4110, 400/41

C08L 83/04 (2006.01) C08G 59/30 (2006.01) C08L 61/06 (2006.01) C08L 63/00 (2006.01) C08L 83/10 (2006.01)

Patent

CA 2030959

CURABLE EPOXY RESIN COMPOSITIONS ABSTRACT Disclosed are curable epoxy resin molding compositions comprising (a) an epoxy resin, optionally a phenolic resin, and (c) a silicone-modified resin selected from a reaction product of an epoxy resin with an amino-modified polysiloxane having an amino group at only one end of its chain or a reaction product of a phenolic resin with an epoxy-modified polysiloxane having an epoxy group at only one end of its chain. The molding compositions retain good moldability while showing excellent mechanical strength and low internal stress.

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