Curable laminating resins of epoxy resin and dicyandiamide

C - Chemistry – Metallurgy – 08 – G

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C08G 59/32 (2006.01) C08G 59/06 (2006.01) C08G 59/30 (2006.01) C08G 59/40 (2006.01) C08J 5/24 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2132403

Curable laminating resins of epoxy resin and dicyandiamide Abstract Curable laminating resins comprising a) post-glycidylated, advanced and bromine-containing aromatic diglycidyl ethers of the formula I Image (I), in which each A and each E independently of one another are each a radical of the formulae Image , Image or Image , in which X is a direct bond or CH2-, -O-, -S- or -SO2-, and at least one A or E is the brominated radical of the formula Image , each G independently of one another is each a hydrogen atom or a glycidyl group, at least one G being a glycidyl group, and n is zero or a number from 1 to 100, b) dicyandiamide and c) if appropriate additional additives, give laminates having high glass transition temperatures, good adhesion to copper and good drillability.

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