Curable mixtures containing an epoxy resin, an imidazolide...

Details Curable mixtures containing an epoxy resin, an imidazolide... Curable mixtures containing an epoxy resin, an imidazolide...

C - Chemistry, Metallurgy

08

L

400/5426, 400/59

C08L 63/00 (2006.01) C08G 59/40 (2006.01) C08G 59/54 (2006.01) C08J 5/24 (2006.01)

Patent

CA 1270589

Curable mixtures containing an epoxy resin, an imidazolide and a polysulfone Abstract of the Disclosure Storage-stable heat-curable mixtures containing (a) 100 parts by weight of an epoxy resin, (b) 3 to 15 parts by weight of an imidazolide of formula I Image wherein e.g. R1 is phenyl, each of R2, R3, R5 and R7 is hydrogen and each of R4, R6 and R8 is methyl, and (c) 2 to 50 parts by weight of a thermoplastic polysulfone with an average molecular weight of at least 10 000. Said mixtures are suitable in particular for the preparation of moulded articles, prepregs and adhesive films with excellent thermal and mechanical properties.

503399

Affiliated with

Also associated with

Rating

Curable mixtures containing an epoxy resin, an imidazolide... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Curable mixtures containing an epoxy resin, an imidazolide..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Curable mixtures containing an epoxy resin, an imidazolide... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1341034