Curable molding compositions

C - Chemistry – Metallurgy – 08 – G

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402/125, 402/182

C08G 63/52 (2006.01) C08F 220/00 (2006.01) C08F 290/14 (2006.01) C08F 299/04 (2006.01) C08L 101/00 (2006.01)

Patent

CA 1188036

ABSTRACT OF THE DISCLOSURE Described herein are curable molding compositions used for the rapid fabrication of fiber-reinforced thermoset resin articles having improved mechanical properties comprising a mixture of: (a) a thermosettable organic material containing two or more polymerizable carbon-carbon double bonds, (b) acrylic or methacrylic acid or a functionalized derivatives thereof having a molecular height of less than 300 which is different from (a), and (c) an ethylenically unsaturated monomer which is soluble in and copolymerizable with (a) and (b) and which is different from (a) and (b). The compositions can also contain one or more fibers with a melting point or a glass transition temperature above about 130°C.

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