C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
402/1, 400/5053,
C08F 299/00 (2006.01) C08F 4/00 (2006.01) C08F 220/00 (2006.01) C08F 290/14 (2006.01) C08F 299/04 (2006.01) C08L 101/00 (2006.01)
Patent
CA 1186098
ABSTRACT OF THE DISCLOSURE Described herein are curable molding compositions used for the rapid production of fiber-reinforced thermoset resin articles having improved mechanical properties, which composition comprises: (a) a thermosettable organic material containing two or more polymerizable carbon-carbon double bonds, (b) an ethylenically unsaturated monomer which forms a liquid homogeneous mixture with and is copolymerizable with (a) and is different from (a), and (c) an effective amount of an initiator or a mixture of initiators characterized by a ten-hour half life temperature, or in the case of a mixture of initiators, an average ten-half hour life temperature, of greater than about 50°C and less than 105°C, which produces on decomposition less than 1.0 milliliter of gas per gram of resin as measured at a temperature of 25°C and a pressure of one atmosphere.
405446
Domeier Linda A.
Gardner Hugh C.
Hopley William G.
Union Carbide Corporation
LandOfFree
Curable molding compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Curable molding compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Curable molding compositions will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1223714