Curable molding compositions containing a vinyl ester resin

Details Curable molding compositions containing a vinyl ester resin Curable molding compositions containing a vinyl ester resin

C - Chemistry, Metallurgy

08

L

400/4008, 400/50

C08L 63/10 (2006.01) C08L 31/02 (2006.01) C08L 33/00 (2006.01)

Patent

CA 1196440

13,117 CURABLE MOLDING COMPOSITIONS CONTAINING A VINYL ESTER RESIN ABSTRACT OF THE DISCLOSURE Described herein are curable molding com- positions comprising a mixture of: (a) a vinyl ester produced by the addition of an unsaturated monocarboxylic acid to a polyepoxide and having a molecular weight greater than 300; (b) acrylic or methacrylic acid or a func- tionalized derivative thereof having a molecular weight of less than 300; (c) an ethylenically unsaturated monomer which is soluble in and copolymerizable with (a) and (b) and which is different from (b). The compositions can also contain one or more fibers with a melting point or a glass transition tem- perature above about 130°C. S P E C I F I C A T I O N

404994

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