C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5328
C08L 83/04 (2006.01) C08K 5/05 (2006.01) C08K 5/45 (2006.01) C08K 5/5425 (2006.01) C08K 5/5435 (2006.01)
Patent
CA 1338750
The addition-curable composition of the present invention, because it comprises a special component as component (D), is characterized by an excellent bonding to any of various substrates with which it is in contact during curing. Component (D) is a mixture, or reaction product, of (a) a silicon-free compound which contains at least 1 alcoholic hydroxyl group and at least 1 alkenyl group in each molecule, and (b) an organosilane having in each molecule at least 1 alkoxy group and at least 1 epoxy or methacryloxy or acryloxy group.
587136
Kasuya Akira
Suzuki Toshio
Dow Corning Toray Silicone Company Limited
Gowling Lafleur Henderson Llp
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