C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 83/07 (2006.01) C08L 83/04 (2006.01)
Patent
CA 2065718
CURABLE ORGANOPOLYSILOXANE GEL COMPOSITION Abstract of the Disclosure A curable organopolysiloxane gel composition comprising (A) a diorganopolysiloxane which contains at least two silicon-bonded alkenyl groups in the molecule and which contains no more than 0.5 weight % of cyclic diorganosiloxanes, (B) an organopolysiloxane resin which contains silicon-bonded alkenyl groups, (C) an SiH-terminated diorganopolysiloxane, (D) a hydrosilylation reaction catalyst, and (E) an inorganic filler. The curable organopolysiloxane gel composition affords a cured gel whose gel properties such as hardness undergo little change with the passage of time.
Enami Hiroji
Nakaya Katsuyoshi
Tanaka Osamu
Dow Corning Toray Silicone Company Ltd.
Gowling Lafleur Henderson Llp
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