Curable polymer compositions comprising polyphenylene ethers...

C - Chemistry – Metallurgy – 08 – L

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400/5426

C08L 71/12 (2006.01) C08J 5/24 (2006.01) C08L 63/02 (2006.01)

Patent

CA 1336845

Blends of high molecular weight polyphenylene ethers with various epoxy materials, particularly poly- glycidyl ethers of bisphenolic compounds, are homogeneous at high temperatures and may be cured in the presence of a catalyst such as aluminum tris(acetylacetonate) or zinc bis(acetylacetonate), especially in the additional presence of an accelerator such as a basic nitrogen compound. The cured compositions have advantageous physical and electrical properties and are useful, for example, for the preparation of printed circuit boards.

569057

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