Curable resin composition

Details Curable resin composition Curable resin composition

C - Chemistry, Metallurgy

08

G

C08G 59/42 (2006.01) C08G 59/17 (2006.01) C09D 163/10 (2006.01)

Patent

CA 2293067

The present invention provides a curable resin composition with excellent low temperature curability and good storage stability comprising (A) a polyepoxide compound, (B) a curing agent containing a functional group selected from carboxyl group and acid anhydride group, and (C) a potential curing catalyst constituted from (a) an onium salt or a tertiary amine and (b) a Lewis acid.

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