Curable resin composition

Details Curable resin composition Curable resin composition

C - Chemistry, Metallurgy

08

F

C08F 220/10 (2006.01) C07F 9/6581 (2006.01) C08F 230/02 (2006.01) C08F 283/00 (2006.01) G03F 7/027 (2006.01)

Patent

CA 2090304

ABSTRACT OF THE DISCLOSURE Disclosed herein is a curable resin composition comprising (A) a curable phosphazene compound, (B) a multifunctional (meth)acrylate-based compound such as dipentaerythritol hexaacrylate and (C) a crosslinkable compound having a cure shrinkage of 6% or less such as (meth)acrylate modified polymer which is a product modified by epoxy. This resin composition provides a cured resin film having a high rate of cure, tractable to coat in a great thickness and further excellent in surface hardness, transparency and weathering resistance.

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