C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
C08J 3/24 (2006.01) C08G 65/336 (2006.01) C08K 5/09 (2006.01) C08K 5/17 (2006.01) C08L 71/02 (2006.01)
Patent
CA 2081242
- 1 - ABSTRACT The present invention is directed to a curable resin composition containing (A) an oxyalkylene base polymer having at least one silicon atom-containing group to the silicon atom of which a hydroxyl group or a hydrolyzable group is attached and being crosslinked through formation of a siloxane bond, and (B) a compound having at least one carboxyl group and a compound having at least one primary amine group. The compositions of the present invention have high curing rates and less toxicity. They are suitable for use as industrial elastomeric materials, sealants, adhesive materials, potting materials, wrapping materials, waterproof materials, templating materials, binders and modifiers.
Suzuki Mikiko
Wakabayashi Hiroshi
Kanegafuchi Chemical Industry Co. Ltd.
Kirby Eades Gale Baker
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