C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5340
C08L 63/00 (2006.01) C08L 83/00 (2006.01) C08L 101/10 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2003127
- 29 - ABSTRACT OF THE DISCLOSURE A curable resin composition comprising (A) 100 parts by weight of an organic rubbery polymer having a cross-linkable group of the formula: Image wherein R1 and R2 are the same or different and each a subs- tituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms, (B) 70 to 500 parts by weight of an epoxy resin, (C) 0.1 to 20 parts by weight of a silanol conden- sation catalyst per 100 parts by weight of the organic rubbery polymer (A), (D) 0.1 to 300 parts by weight of a curing agent for the epoxy resin per 100 parts by weight of the epoxy resin (B), and (E) a silicon-containing compound having a cross- linkable group of the formula: Image wherein R1 and R2 are the same as defined and a functional group reactive with an epoxy group, wherein a weight ratio of the total weight of the organic rubbery polymer (A) and the epoxy resin (B) to the weight of the silicon-containing compound (E) is from 100:0.1 to 100:20, which provides a cured product with high modulus.
Homma Michihide
Isayama Katsuhiko
Wakabayashi Hiroshi
Yoshihara Atsuko
Kanegafuchi Chemical Industry Co. Ltd.
Kirby Eades Gale Baker
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