Curable resin composition and curing method

Details Curable resin composition and curing method Curable resin composition and curing method

C - Chemistry, Metallurgy

08

L

C08L 83/06 (2006.01) C08G 77/42 (2006.01) C08L 83/04 (2006.01) C09D 183/06 (2006.01) C09D 183/10 (2006.01) C09D 201/06 (2006.01)

Patent

CA 2050034

CURABLE RESIN COMPOSITION AND CURING METHOD Abstract of the Disclosure: The invention provides a curable resin composition comprising (I) at least one polysiloxane resin selected from the group consisting of (i) a polysiloxane resin which is a reaction product prepared by condensation of a silane compound (A) having at least one hydroxyl group and/or hydrolyzable group respectively directly attached to the silicon atom, the polysiloxane resin (i) having at least one hydroxyl group and/or hydrolyzable group respectively directly attached to the silicon atom on the average per molecule of the reaction product, and (ii) a polysiloxane resin which is a reaction product of the silane compound (A) having at least one hydroxyl group and/or hydrolyzable group respectively directly attached to the silicon atom with a silane compound (B) having at least one hydroxyl group and/or hydrolyzable group respectively directly attached to the silicon atom and at least one epoxy group, the polysiloxane resin (ii) having at least one hydroxyl group and/or hydrolyzable group respectively directly attached to the silicone atom on the average, and at least one epoxy group on the average and per molecule of the reaction product, and (II) a hydroxyl-containing resin or a hydroxyl- and carboxyl-containing resin.

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