C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5301
C08L 101/00 (2006.01) C08J 3/12 (2006.01) C08L 79/08 (2006.01) C08L 83/04 (2006.01)
Patent
CA 1337881
The curable resin composition of the present invention consists of a curable resin and the spherical microparticles of cured silicone rubber obtained by the curing of an addition reacting silicone rubber composi- tion, wherein the silicone rubber composition also con- tains an epoxy compound having an aliphatically unsatu- rated group. Furthermore, because the microparticles are prepared from an aqueous emulsion or aqueous dispersion of the silicone rubber composition, they have an extremely small particle size. The curable resin compositions of this invention can be used as an insulating material for electrical and electronic components, in the form of precision moldings, sealants, casting agents, coatings, and powder coatings.
575277
Morita Yoshitsugu
Yokoyama Noriyasu
Yoshida Keiji
Dow Corning Toray Silicone Company Limited
Gowling Lafleur Henderson Llp
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