Curable resin compositions

Details Curable resin compositions Curable resin compositions

C - Chemistry, Metallurgy

08

L

400/5050, 400/55

C08L 33/00 (2006.01) C08F 2/48 (2006.01) C08F 20/10 (2006.01) C08F 299/00 (2006.01) C08L 63/00 (2006.01) C08L 75/04 (2006.01)

Patent

CA 1149538

TITLE OF THE INVENTION: Curable Resin Composition ABSTRACT OF THE DISCLOSURE: A photo- and thermo-curing resin composition comprising of one or more resins having acryloyl and/or methacryloyl groups; one or more photopolymerization initiators and/or thermo-curing initiators; and one or more inorganic fillers. It is best adapted for use for tack bonding electronic component parts to base plates or substrates in the production of printed-circuit boards.

348139

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