C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 83/06 (2006.01) C08L 83/14 (2006.01) C08L 83/16 (2006.01) C08L 101/06 (2006.01) C09D 167/00 (2006.01) C09D 183/06 (2006.01) C09D 183/16 (2006.01) C09D 201/06 (2006.01) C09J 183/06 (2006.01) C09J 201/06 (2006.01)
Patent
CA 2079481
-46- CURABLE RESIN COMPOSITIONS ABSTRACT: The present invention provides a curable resin composition comprising a glycol-modified silicon compound (I) and a resin (II) having at least two hydroxyl groups in the molecule on the average and admixed with the silicon compound (I), the silicon compound (I) being obtained by reacting a glycol with a silicon compound represented by the formula Image (1) wherein R1 is a monovalent C1-20 hydrocarbon group, -R'-O-R" group, -R'-OOC-R" group or organic group having at least one epoxy group, and the groups R2 are the same or different and are each a hydroxyl group or hydrolyzable group, R' being a bivalent C1-8 hydrocarbon group, R" being a monovalent C1-10 hydrocarbon group, the silicon compound (I) having a structural unit represented by the formula Image (2) wherein R1 and R2 are as defined above, and A is a residue of the glycol; and a curing method comprising applying the curable resin composition to a substrate and -47- heating the resulting coating for curing.
Aida Haruhiko
Isozaki Osamu
Barrigar & Moss
Kansai Paint Company Limited
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