Curable resin compositions useful as hot-melt adhesives

Details Curable resin compositions useful as hot-melt adhesives Curable resin compositions useful as hot-melt adhesives

C - Chemistry, Metallurgy

08

L

C08L 77/08 (2006.01) C08L 63/00 (2006.01) C09J 163/00 (2006.01) C09J 177/08 (2006.01)

Patent

CA 2065185

ABSTRACT CURABLE RESIN COMPOSITIONS AND PROCESS FOR THE PREPARATION THEREOF A resin composition is described which comprises: - a thermoplastic, substantially amine-terminated polyamide resin having an amine plus acid number between about 1 and about 50 and having an excess of free amine to acid groups; - a reactive diluent containing a polar group; and - an epoxy resin having at least two epoxy groups per molecule of epoxy resin; wherein the initial ratio of the epoxy groups to free amine groups is between about 1:1 and about 10:1. The diluent serves to reduce the viscosity of said polyamide resin without adversely affecting the strength of the resin composition. A process for the preparation of the resin compositions is described. The compositions of the invention are useful as hot-melt adhesives.

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