Curable resinous composition comprising epoxy resin and...

Details Curable resinous composition comprising epoxy resin and... Curable resinous composition comprising epoxy resin and...

C - Chemistry, Metallurgy

08

L

400/4107

C08L 63/02 (2006.01) C08G 59/40 (2006.01) C08L 43/04 (2006.01) C08L 63/00 (2006.01) C08L 83/10 (2006.01)

Patent

CA 1235245

- 1 - Abstract The invention provides a curable resinous com- position comprising: (A) an organic elastomeric polymer having at least one silicon-containing reactive group in the molecule, (B) an epoxy resin, (C) a silicone compound having a silicon-containing group and a functional group reactive with an epoxy group, and (D) a curing agent for the epoxy resin. The silicon-containing reactive group is a group of the formula: Image (I) wherein X is a hydroxyl group or a hydrolyzable group, R1 is a monovalent hydrocarbon group having 1 to 20 carbon atoms or an organosiloxy group, "a" is 0, 1, 2 or 3, "b" is 0, 1 or 2 provided that the total of "a" and "b" is at least 1, and "m" is 0 or an integer of 1 to 18. The weight ratio of (A) to (B) is from 1:100 to 100:1 and the weight ratio of (A)+(B) to (C) being from 100:0.1 to 100:20. This composition produces a cured product hav- ing improved mechanical properties, such as flexibility, impact resistance, toughness and strength.

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