C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 63/00 (2006.01) B32B 5/26 (2006.01) C08G 59/18 (2006.01) C08G 59/42 (2006.01) C08G 59/50 (2006.01) C08L 51/00 (2006.01) C08L 51/04 (2006.01) C08L 63/02 (2006.01) C09J 151/04 (2006.01)
Patent
CA 2100026
Curable suspensions of epoxy resins Abstract of the Disclosure Curable suspensions of an epoxy resin formulation comprising a) a storage-stable suspension of an epoxy resin and a toughener suspended therein which contains no groups that react with a curable epoxy resin system, b) dicyandiamide, a polycarboxylic acid, a polycarboxylic anhydride, a polyamine, a polyaminoamide, an amino group-containing adduct of an amine and a polyepoxide, a polyol or a catalytically curing hardener, and, as optional components, c) a curing catalyst, conventional fillers, reinforcing materials or additives, are particularly suitable for use as as casting resins, laminating resins or an adhesives.
Eldin Sameer H.
Gruber Urs
Peyer Robert P.
Setiabudi Frans
Fetherstonhaugh & Co.
Vantico Ag
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