Curable systems containing epoxy resin

Details Curable systems containing epoxy resin Curable systems containing epoxy resin

C - Chemistry, Metallurgy

08

K

400/5027, 400/79

C08K 5/35 (2006.01) C08G 59/18 (2006.01) C08J 3/09 (2006.01) C08L 63/00 (2006.01) C08L 63/02 (2006.01) C08L 77/00 (2006.01)

Patent

CA 1099428

ABSTRACT OF THE DISCLOSURE A curable system such as a curable adhesive type system having a relatively long pot life is disclosed. The curable system of the present invention comprises polymer containing material including at least one curable epoxy resin, at least one imidazole type catalytic curing agent for the resin and a solvent for the epoxy resin capable of suppressing or inhibiting the cata- lytic reaction between the resin and curing agent at least at about room temperature, the solvent being selected from methanol, ethanol and mixtures thereof.

297940

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