Curing agent compositions, laminating varnishes containing...

Details Curing agent compositions, laminating varnishes containing... Curing agent compositions, laminating varnishes containing...

C - Chemistry, Metallurgy

08

G

402/102, 154/140

C08G 59/62 (2006.01) C08J 5/24 (2006.01)

Patent

CA 1310442

ABSTRACT Curing agents for epoxy resins are disclosed which comprise a mixture of a halogen substituted dihydric phenol such as tetrabromobisphenol A and a material having an average of more than two phenolic hydroxyl groups per molecule such as a phenol- formaldehyde novolac resin. The curing agents are particularly useful in epoxy resin varnish formulations for preparing prepreg laminating materials for use in electrical and electronic applications.

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