C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
402/270
C08K 5/34 (2006.01) C08G 59/50 (2006.01) C08L 63/00 (2006.01)
Patent
CA 1172000
CURING AGENTS FOR EPOXY RESINS ABSTRACT OF THE DISCLOSURE Novel unitary, storable, heat-curable epoxy resin systems are prepared which contain a polyepoxide and a curing amount of a salt of piperazine and a C3-C21 polycarboxylic acid. In a preferred aspect the salt is present in a stoichiometric amount. The resin system is cured into an insoluble, infusible resin product by heating thereof at a temperature greater than 50°C, preferably 50-250°C, for a time suf- ficient to complete the cure.
370939
Borden Ladner Gervais Llp
National Starch And Chemical Corporation
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