Curing compositions having low-free amounts of...

C - Chemistry – Metallurgy – 08 – G

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C08G 18/32 (2006.01) C08G 18/10 (2006.01) C08K 5/00 (2006.01) C08K 5/18 (2006.01)

Patent

CA 2754171

A curing composition of a coordination complex comprising methylenedianiline (MDA) and a salt, and less than 1000 of free MDA. The curing composition may be used in curing polyurethanes and epoxy resins.

La présente invention concerne une composition durcissable à base d'un complexe de coordination comprenant de la méthylènedianiline (MDA) et un sel, et moins de 1 000 de MDA libre. La composition durcissable peut être utilisée dans le durcissement de résines polyuréthanes et époxy.

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