Curing resin composition and its cured product

Details Curing resin composition and its cured product Curing resin composition and its cured product

C - Chemistry, Metallurgy

08

L

400/5349

C08L 83/05 (2006.01) C08K 5/5419 (2006.01) C08L 57/00 (2006.01) C08L 101/02 (2006.01)

Patent

CA 2039050

This invention discloses a curing resin composition comprising (a) an organic resin containing no less than 2 alkenyl groups per molecule, and having a number average molecular weight of 500-100,000, (b) an organohydrogen-polysiloxana containing no less than 2 Si-H bonds per molecule, and (c) a platinum catalyst. It is desired that the organic resin of component (a) is at least one type chosen from acrylic, polyester and epoxy. The preferable amount of component (b) is such that there are 0.8-4 hydrogen atoms bonded to silicon atoms per alkenyl group of component (a).

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