Curing silicon hydride containing materials by exposure to...

Details Curing silicon hydride containing materials by exposure to... Curing silicon hydride containing materials by exposure to...

B - Operations, Transporting

05

D

B05D 3/04 (2006.01) B05D 5/12 (2006.01) C04B 41/45 (2006.01) C04B 41/50 (2006.01) H01L 21/31 (2006.01) H01L 21/316 (2006.01) H01L 21/48 (2006.01) H01L 21/56 (2006.01) H01L 23/29 (2006.01) H01L 21/314 (2006.01)

Patent

CA 2100278

CURING SILICON HYDRIDE CONTAINING MATERIALS BY EXPOSURE TO NITROUS OXIDE ABSTRACT The present invention relates to a low temperature method of forming silica-containing ceramic coatings on substrates. The method involves applying a coating comprising a silicon hydride containing resin on a substrate and heating the coated substrate under an environment comprising nitrous oxide at a temperature sufficient to convert the resin to the silica-containing ceramic coating. This method is especially valuable for forming protective and dielectric coatings on electronic devices.

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