Cut-clinch mechanism for variably spaced leads

B - Operations – Transporting – 21 – F

Patent

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164/121, 26/90

B21F 11/00 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1102532

Abstract of the Disclosure The mechanism cuts component lead portions projecting from a support such as a circuit board though the leads may be spaced apart at different distances, and then clinches them against the board. Additionally, the mechanism is movable heightwise relative to the support for clearance purposes and adapted to be shifted both in X-Y directions and with selected radial orientation between preset angles. The clinching is done in opposite directions and normal to a line interconnecting the points from which the leads protrude thereby stabilizing the position of a component body.

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