Cutting brittle materials

Details Cutting brittle materials Cutting brittle materials

B - Operations, Transporting

28

D

342/42, 30/63

B28D 1/26 (2006.01) B06B 3/00 (2006.01) B28D 5/04 (2006.01)

Patent

CA 1335902

A method of cutting a brittle workpiece comprises applying to the surface of the workpiece a pointed tool, applying high frequency vibrations in a longitudinal direction to the tool, and moving the tool along a line to be cut of the workpiece while applying substantially steady longitudinally directed pressure to the tool. Stress is thereby applied to the workpiece as a combination of short impulses and steady direct stress and the breaking stress of the material would be attained coincident with the peak oscillatory stress. Crack propagation would therefore proceed by a series of stepwise fractures induced by successive cyclic stress peaks, resulting ultimately in the separation of the workpiece into two pieces. An apparatus for carrying out the method comprises a piezoceramic transducer to generate ultrasonic vibrations, a tip to be applied to the workpiece and having a hardness greater than that of the workpiece, and means to convey the ultrasonic vibrational energy to the tip.

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