Cutting die and method of making

B - Operations – Transporting – 23 – P

Patent

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Details

B23P 15/40 (2006.01) C21D 1/09 (2006.01) C21D 9/18 (2006.01) C21D 6/04 (2006.01)

Patent

CA 2245866

A cutting die (13, 14) is made by milling the blade (14) shapes in a die (13) surface and then scanning the blades (14) with a laser (10) beam or other high energy beam or induction field to heat and then harden the blades (14). To minimize back-annealing of previously-hardened, intersecting blades, the traverse speed and laser intensity is controlled. Alternately, liquid/gas cooling (30, 31) is directed onto the intersecting blades.

La présente invention concerne un procédé de fabrication d'un emporte-pièce (13, 14) consistant à fraiser les formes (14) de lames dans une surface d'emporte-pièce (13) puis à balayer les lames au moyen d'un faisceau laser (10), de tout autre faisceau haute énergie, ou d'un champ d'induction, de façon à chauffer et durcir les lames (14). Pour minimiser l'inversion de recuit des intersections de lames préalablement durcies, le procédé permet de réguler la vitesse de déplacement transversal ainsi que l'intensité du laser. Selon une autre réalisation, le procédé met en oeuvre un refroidissement par liquide ou gaz (30, 31) dirigé sur les intersections de lames.

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