Cutting of organic solids by continuous wave ultraviolet...

Details Cutting of organic solids by continuous wave ultraviolet... Cutting of organic solids by continuous wave ultraviolet...

B - Operations, Transporting

23

K

B23K 26/08 (2006.01) B23K 26/40 (2006.01)

Patent

CA 2051210

A beam (12) of continuous wave ultraviolet light having a wavelength that is absorbed by an organic solid (20) is focused to a spot (18) on a surface of the organic solid (20). Relative motion is imparted between the beam (12) and organic solid (20) at a rate that defines, together with a dimension of the spot (18), an effective pulse width. Within prescribed ranges of the wavelength, power density and effective pulse width, a new cutting regime was discovered whereby organic solids can be cut at rates and with a quality of cuts previously requiring pulsed ultraviolet laser sources.

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