Cutting substrate and method of manufacturing same

Details Cutting substrate and method of manufacturing same Cutting substrate and method of manufacturing same

B - Operations, Transporting

32

B

B32B 3/04 (2006.01) A47J 47/00 (2006.01) B32B 7/02 (2006.01)

Patent

CA 2515678

A single use processing substrate includes a first section (404) having a cut resistant surface, a second liquid impermeable section (406), and a fold line (406) disposed along a length of the substrate between the first section (404) and the second section (406), wherein folding along the fold line (408) forms the processing substrate.

La présente invention a trait à un substrat de traitement jetable comportant une première portion (404) présentant une surface résistante aux coupures, une deuxième portion imperméable aux liquides (406), et une ligne de pliage (406) disposée sur une longueur du substrat entre la première portion (404) et la deuxième portion (406), le pliage le long de la ligne de pliage (408) formant le substrat de traitement.

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