Cutting substrate and/or support surface

Details Cutting substrate and/or support surface Cutting substrate and/or support surface

B - Operations, Transporting

32

B

B32B 3/02 (2006.01) A47J 47/00 (2006.01) B32B 7/02 (2006.01) B32B 7/06 (2006.01)

Patent

CA 2515620

A single use processing substrate includes a cut resistant surface (100), at least one absorbent layer (104) adjacent the cut resistant surface (100) and a liquid impervious barrier (106) adjacent the at least one absorbent layer (104). In a first embodiment, the substrate includes a score line (114) disposed across the substrate for separating the substrate into two substrates. In another embodiment, the substrate includes a lateral fold line disposed along a width of the substrate and a plurality of fold lines extending from corners of the substrate.

La présente invention concerne un substrat de traitement à usage unique qui comprend une surface résistante aux coupures (100), au moins une couche d'absorbant (104), adjacente à la surface résistante aux coupures (100), ainsi qu'une barrière imperméable aux liquides (106), adjacente à la couche d'absorbant (104). Dans un premier mode de réalisation, le substrat comprend une ligne de coupe (114) placée en travers du substrat, conçue pour séparer le substrat en deux substrats. Dans un autre mode de réalisation, le substrat comprend une ligne de pliage latérale placée sur une largeur du substrat et une pluralité de lignes de pliage qui s'étendent depuis les coins du substrat.

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