Cutting using high energy radiation

B - Operations – Transporting – 23 – K

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

327/1.5

B23K 26/00 (2006.01) B23K 26/36 (2006.01)

Patent

CA 1325041

ABSTRACT In order to make a laser cut in a diamond , the diamond is reciprocated transversely, the radiation is focussed onto the bottom of the cut by a stationary focussing lens, and the radiation is passed to the focussing lens by a mirror which is reciprocated in the same direction as the diamond, thereby rocking the axis of the beam below the lens. This increases the energy entering the cut and reduces the focal spot area projecting on the cut wall, thus increasing the energy density of radiation on the inclined cut walls.

608273

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Cutting using high energy radiation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cutting using high energy radiation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cutting using high energy radiation will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1180324

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.