Cyanate resin composition and copper-clad laminate

Details Cyanate resin composition and copper-clad laminate Cyanate resin composition and copper-clad laminate

C - Chemistry, Metallurgy

07

C

C07C 261/02 (2006.01) B32B 15/08 (2006.01) C08G 59/40 (2006.01) C08G 73/00 (2006.01) C08G 73/02 (2006.01) C08G 73/06 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2115409

ABSTRACT CYANATE RESIN COMPOSITION AND COPPER-CLAD LAMINATE A cyanate resin composition suitable for a copper-clad laminate comprises components (A) and (B). (A) a cyanate compound of the formula: Image wherein R and Q each represents halogen, C1 - 10 alkyl, C5 - 7 cycloalkyl or C6 - 20 hydrocarbon; i and j each represents 0-4 and M is (2): Image , Image , Image or Image wherein T represents halogen, C1 - 10 alkyl, C5 - 7 cycloalkyl or C6 - 20 hydrocarbon; k represents 0-10 and m represents 0-8, and (B) a hardener.

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