C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 73/00 (2006.01) B32B 15/08 (2006.01) C08G 59/40 (2006.01) C08G 73/06 (2006.01) C08G 73/12 (2006.01) H05K 1/03 (2006.01)
Patent
CA 2115537
ABSTRACT OF THE DISCLOSURE: A cyanate resin composition comprising as essential components a cyanate compound represented by formula (1) or its prepolymer and a curing agent: Image (1) wherein each of R1 and R2 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms; A represents an alkyl group having 1 to 3 carbon atoms; i represents an integer of 0 to 3 alone or together with a brominated epoxy compound or a maleimide compound or its prepolymer, said cyanate resin composition giving a cured product having a low-dielectric constant, and a copper-clad laminate composed of a prepreg of said cyanate resin composition and a copper foil.
Endo Yasuhiro
Kanagawa Shuichi
Kitayama Shinichiro
Shibata Mitsuhiro
Ueda Yoichi
Fetherstonhaugh & Co.
Sumitomo Chemical Co. Ltd.
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