Cyanide-free copper plating process

Details Cyanide-free copper plating process Cyanide-free copper plating process

C - Chemistry, Metallurgy

25

D

204/36

C25D 3/38 (2006.01)

Patent

CA 1244377

ABSTRACT A process for depositing a ductile, fine-grained adherent copper plate on a conductive substrate employing an electrolyte containing controlled effective amounts of cupric ions, a complexing agent for the cupric ions, a bath stabilizing and buffering agent, and hydroxyl and/or hydro- gen ions to provide a pH from about 6 to about 10.5. The process includes electrolyzing the aforementioned electro- lyte employing a combination of a bath soluble copper anode and an insoluble nickel-iron alloy anode containing about 10 percent to about 40 percent by weight iron and about 0.005 to about 0.06 percent sulfur to provide a copper anode area to nickel-iron alloy anode surface area ratio within a range of about 1:2 to about 4:1.

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