C - Chemistry – Metallurgy – 07 – F
Patent
C - Chemistry, Metallurgy
07
F
260/457.3
C07F 9/09 (2006.01) C07F 9/6574 (2006.01) C07F 9/6578 (2006.01)
Patent
CA 1171872
ABSTRACT OF THE DISCLOSURE The disclosure describes compounds of the formula: Image wherein A represents a bond directly connecting two phenyl rings to form a biphenyl ring or the moiety selected from the group consisting of (lower)alkylene, aryl substituted (lower) alkylene, cycloalkylidene, sulfonyl and oxo groups, R1 rep- resents allyl, acryloyloxy (lower) alkyl or methacryloyloxy (lower) alkyl radicals, in which the (lower) alkyl portion can be substituted by halogen atoms, and R2 represents hydrogen, halogen, lower alkyl or lower alkoxy. The preparation of these compounds is also disclosed. The compounds are easy to polymer- ize due to the vinyl group in R1 and can be used as components of dental filling materials.
367042
Komura Tamotsu
Miyoshi Nobuyoshi
Tsunekawa Masayoshi
Sankin Industry Co. Ltd.
Swabey Ogilvy Renault
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