Cylindrical magnetron sputtering cathode, as well as...

H - Electricity – 01 – J

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353/17, 313/97

H01J 37/34 (2006.01) C23C 15/00 (1980.01)

Patent

CA 1169467

ABSTRACT The cylindrical magnetron sputtering cathode of the present inven- tion essentially comprises a tubular target having a face of material to be sputtered, and a magnet assembly disposed behind the back face of said tubular target for generating magnetic fields having flux lines which form arch portions over the sputtering face. This magnet assembly more specifi- cally consists of a plurality of equiangularly spaced axially extending radially magnetized magnets arranged in such a manner as to form over the sputtering face a plurality of equiangularly spaced axially extending straight arch portions connected to each other by arcuate arch end-portions, whereby defining at least one closed-loop arch over said sputtering face. This magnetron sputtering cathode further comprises closure means for delimitating in combination with the back face of said tubular target a cylindrical tight chamber enclosing the magnet assembly, as well as means for axially circulating a liquid coolant within said tight chamber, whereby ensuring a proper cooling of said cathode by enabling said liquid coolant to freely flow along the longitudinal spaces delimitated between adjacent magnets of said assembly.

383415

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