H - Electricity – 01 – J
Patent
H - Electricity
01
J
H01J 37/34 (2006.01)
Patent
CA 2567372
In some embodiments, the invention includes a cylindrical cathode target assembly for use in sputtering target material onto a substrate that comprises a generally cylindrical target, mean for rotating the target about its axis during a sputtering operation, an elongated magnet carried within the target for generation of a plasma-containing magnetic field exterior to but adjacent the target, a framework for supporting the magnet against rotation within the target, and a power train for causing the magnet to oscillate within and axially of the target in a substantially asynchronous manner to promote generally uniform target utilization along its length, as well as its method of use. In some embodiments, the magnet is oscillated in response to rotation of the target.
Dans certains modes de réalisation, on prévoit un ensemble cible cathodique cylindrique utilisé dans une matière cible de pulvérisation cathodique sur un substrat comprenant une cible normalement cylindrique, des moyens de rotation de la cible atour de son axe pendant la pulvérisation cathodique, un aimant allongé logé dans la cible en vue de la génération d'un champ magnétique contenant du plasma externe mais adjacent à la cible, un cadre de support de l'aimant par rapport à la rotation au sein de la cible, et un train de puissance faisant osciller l'aimant dans et axialement par rapport à la cible de manière sensiblement asynchrone afin de favoriser une utilisation de la cible normalement uniforme le long de sa longueur, ainsi que son procédé d'utilisation. Dans certains modes de réalisation, l'aimant oscille sous l'effet de la rotation de la cible.
Hartig Klaus
Madocks John E.
Smith Steve E.
Borden Ladner Gervais Llp
Cardinal Cg Company
General Plasma Inc.
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